After rumours, MediaTek has confirmed the launch of the company's next flagship chip at an event in China on September 22nd, which should be the Dimensity 9500. This is cheduled a day before Qualcomm unveils the Snapdragon 8 Elite Gen 5 flagship chip at the Snapdragon Summit.
Based on earlier reports, the Dimensity 9500 will use 1 x 4.21GHz Travis + 3 x 3.50GHz Alto + 4 x 2.7GHz Gelas cores, among which Travis and Alto are Arm's new generation X9 series prime, and Gelas is Arm's new A7 series performance core.
The GPU is the new Mali-G1-Ultra MC12, which uses a new microarchitecture. The GPU energy efficiency is expected to increase by more than 40%, the mobile ray tracing performance is expected to increase by more than 40%, and the ray tracing frame rate is expected to exceed 100FPS.
Its L3 cache is said to reach 16MB, SLC 10MB, and is expected to support SME instruction set, NPU 9.0 is expected to be 100TOPS, and supports 4x LPDDR5x 10667Mbps+4-Lane UFS4.1.
Even though early Geekbench results for the chip surfaced earlier this month in Find X9 test device, the OPPO Find X9 Pro with the model number PLG110 has surfaced in latest Geekbench listing revealing 3393 Single-Core and 9974 Multi-Core scores.
The Dimensity 9500 will first debut in the vivo X300 series, but it is said to launch only in October, on October 13th. Last week, vivo product manager Han Boxiao said that the vivo X300 Pro satellite edition has scored 4 million points on AnTuTu 11.
We should know all the details about the Dimensity 9500 and the devices powering it when it goes official next week.
Even though, the Dimensity 9500 will stick to TSMC's 3nm process, MediaTek today confirmed that the company has successfully adopted TSMC's 2nm process for its next flagship chip, becoming one of the first companies to adopt TSMC's 2nm technology.
TSMC's 2nm process technology debuts a nanosheet transistor structure, which promises improved performance, power efficiency, and yield. Compared to the existing N3E process, TSMC's enhanced 2nm process technology increases logic density by 1.2 times, improves performance by up to 18% at the same power consumption, and reduces power consumption by approximately 36% at the same speed.
MediaTek's first chip using TSMC's 2nm process is expected to be available by the end of 2026, confirmed the company, so we can expect the Dimensity 9600 to use the 2nm process.